With the recent news on the NEW 3DS, I began to wonder. Nintendo is likely working on their new console for the 9th generation. It’s no secret. All companies start planning their next hardware 1-2 years after launching a predecessor. Rumors of the ”Nintendo Fusion” discuss merging Nintendo’s handheld and home console departments to create one super platform. But one thing we don’t know for sure, is the details, plans, and specifications of the next-generation merger. Before I go any further, let me make a disclaimer: these are my thoughts and they aren’t based on prior knowledge – I don’t have a “source”.
That being said, the rumored specifications don’t sound too far-fetched from things Nintendo have said from their own mouths and things I see in the potential of the NEW 3DS.
This is what an insider had to say according to our friends at GaminRealm:
“Before I go into the detail on the Software and OS features I overheard, I will like to do a upgraded recap on the specs of both machines. The codename is now “FUSION” and many the R&D want to keep that name for the main console release. The Handheld unit is called the “FUSION DS” while the home unit is called “FUSION TERMINAL.”
>CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
>COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery
>GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
>CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
>Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
>MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.
“Nintendo has already begin making demo software for the targeted prototype hardware in efforts to curb the Wii U mistake in the software pipeline (they started creating software after prototyping and were unable to give major software push the first two years as a result). Nintendo plans to make most of the software prototypes into games and applications around the launch of the unit.”
Isn’t it odd that all of a sudden the 3DS is getting a new iteration with stronger hardware and better capabilities such as an NFC reader, more memory, new NNID changes (allegedly), and more buttons? It may be possible for the NEW 3DS to interact with the Wii U as a second gamepad based on some things Nintendo have stated previously. Put two and two together, folks. The NEW 3DS users will be beta testers for the fabled “Nintendo Fusion” (shout outs to Rodney S. for this specific and fitting quote).